industrial inspection systems
"
সিএসপি LED 110kV এক্স রে স্ক্যানার 5um LED স্ট্রিপ PCBA সোল্ডারিং এর জন্য
110kV 5um microfocus AX8500 X-ray for LED Strip PCBA soldering void quality control Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size
CSP BGA X Ray Scanner Machine 100KV FPD Microfocus Closed Tube AX8500
High resolution FPD with microfocus closed tube AX8500 X-ray system from Unicomp for LED inner bubble and void testing Technical Parameters and Specifications System SummaryFootprint1370(W)×1300(D)×1700(H)mmMachine Weight1600 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size1750(W)×1500(D)×2000(H)mmPacking Weight1800 kgPower Consumption2.0 kWX-Ray TubeTube TypeSealedMax. Power25WVoltage0~110kV (Adjustable)Focus Spot Size5μmImaging SystemDetectorFlat Panel Detector (FPD
SMT PCBA BGA QFN এর জন্য CSP SMT ইলেকট্রনিক্স এক্স রে মেশিন 110kV Unicomp AX8500
Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
SMT BGA ইলেকট্রনিক্স এক্স রে মেশিন FPD 1000X ম্যাগনিফিকেশন Unicomp AX8500
Unicomp AX8500 X Ray with FPD Detector and 1000X Magnification to check Semiconductor components quality issue Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel
পিসিবি পরীক্ষার জন্য উচ্চ অনুপ্রবেশ ইনলাইন 3D সিটি মেশিন এক্স রে মেশিন Unicomp LX9200
High penetration inline 3D CT machine X-Ray machine for PCB testing Unicomp LX9200 with real-time display Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type:BGA,LGA,CSP,POP,SIP... Defect type:Void,HIP,Insufficient,Bridge... Semiconductor
অনলাইন উত্পাদনের লাইন রিয়েল টাইম এক্স রে যন্ত্র, 160 কেভি এক্স রে র্যাডোগ্রাফি এনডিটি টেস্ট
Online Production Line Real Time X Ray Inspection Equipment System 160KV Whether in the automotive, electronics or aircraft industry or for ship and vessel construction, Unicomp Technology is offering industrial X-ray inspection systems for nondestructive material testing which can fit in any manufacturing process and guarantee highest quality and safety standards for industrial products. 1. Full cycle support from products design to testing procedures and high-quality
মাইক্রো ফোকাস ইলেক্ট্রনিক্স এক্স রে সিস্টেম এসএমটি ইলেক্ট্রনিক্স অভ্যন্তরীণ ত্রুটি নিয়ন্ত্রণ
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
অ্যালুমিনিয়াম মরা এসএমটি / ইএমএস এক্স রে মেশিন সিএনসি BGA ভয়েস জন্য প্রোগ্রামেবল সনাক্তকরণ
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 3µm closed X-ray tube, high speed &
2.5 ডি শিরোনাম ইলেকট্রনিক্স এক্স রে মেশিন 40W ঘূর্ণন 360 ° 6 অক্ষ আন্দোলনের সাথে
Application SMT, BGA, CSP, Flip Chip, LED Detection, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Features Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with convenient target point positioning system 130kV (Option 110KV) 7µm closed X-ray tube,
