bga x ray machine
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চিপের অভ্যন্তরীণ ত্রুটি পরিদর্শনের জন্য 90KV মাইক্রোফোকাস 2.5D এক্স-রে পরিদর্শন সিস্টেমের ইউনিকম্প কারখানা সরবরাহ
Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
সেমিকন্ডাক্টরের জন্য Unicomp AX8200MAX এক্স রে পরিদর্শন সরঞ্জাম
Unicomp AX8200 X Ray Inspection Equipment For Semiconductor Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable)
লিথিয়াম ব্যাটারি ক্যাথোডের জন্য 4-অক্ষ ম্যানিপুলেটর এক্স-রে স্ক্যানিং মেশিন ইউনিকম্প AX8200B
AX8200B X-Ray machine for cylindrical lithium battery CNC programmable inspection with auto measurement Features: ● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera. ● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement. ● Multi-function DXI image processing system ● X/Y programming function for multiple image inspection routines ● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X
সিই কম্পিউটার মাদারবোর্ড চিপসেট এক্স রে পরিদর্শন মেশিন AX9100
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
অটো পার্টসের জন্য Z Axis Unicomp X Ray 0.8KW FPD ডিটেক্টর
Using Unicomp X-ray inspection machine for medical indwelling needle inside quality measurement Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area
ইউনিকম্প এক্স-রে সিস্টেম AX8200max একাধিক পরিমাপ সরঞ্জাম সহ
Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
100KV ইনলাইন এক্স রে ADR ডিটেকশন সিস্টেম বিজিএ ইএমএস ভিতরের গুণমান পরিদর্শনের জন্য
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● Real-time image. ● 1000X system magnification. ● 100KV 5μm X-Ray tube. ● Modular design with In-line expansibility. ● Economical and Practical. ● FPD Detector. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta
সিএনসি প্রোগ্রামিং এক্স রে ডিটেক্টর পিসিবিএ বিজিএ সিএসপি কিউএফএন জন্য স্বয়ংক্রিয়
Automatic Measurement With CNC Programming X-Ray Equipment For PCBA BGA CSP QFN Reflow Soldering Quality Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Test Images: Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 5μm X-Ray tube. ●
রিয়েল টাইম ইউনিকম্প এক্স এক্স 1.6 কেডব্লিউ এএক্স 9100 ইলেক্ট্রনিকস অ্যাসেমব্লির জন্য
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power
