bga x ray machine
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বিজিএ কিউএফএন ইউনিকম্প এক্স এক্স পরিদর্শন সিস্টেম 130 কেভি 6 অ্যাক্সিস মুভমেন্ট সহ
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
ইনলাইন Unicomp LX9200 X Ray পরিদর্শন সিস্টেম PCB / BGA বিশ্লেষণের জন্য উচ্চ নির্ভুলতা
Inline High-Precision 3D X-Ray Tomography for PCB and BGA Analysis Unicomp LX9200 X-Ray inspection system Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge... Semiconduc
Unicomp LX9200 3D CT X Ray কম্পিউটেড টেমোগ্রাফি মেশিন 130KV ইনলাইন PCB BGA পরিদর্শনের জন্য
Unicomp high quality 130KV inline Unicomp LX9200 3D CT X-Ray computed temography machine for PCB BGA inspection Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge...
উচ্চ কর্মক্ষমতা সহ সিল করা PCB এক্স-রে পরিদর্শন মেশিন AX8200max
90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Specification Of SMT X-Ray machine Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector
Unicomp AX8500 110kV 5um 2.5D এক্স-রে জন্য ইলেকট্রনিক্স SMT PCBA BGA IC সোল্ডারিং গুণমান পরীক্ষা
Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
PCBA BGA QFN LED সোল্ডারিং শূন্যতা পরিদর্শনের জন্য FPD 55° টিল্টিং ভিউ সহ 5μm মাইক্রোফোকাস এক্স-রে
5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
এসএমটি বিজিএ সোল্ডারিংয়ের জন্য মাইক্রোফোকাস ক্লোজড টিউব ইউনিকম্প এক্স এক্স 130 কেভি 3 ম
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnificati
সঠিক PCB/BGA পরিদর্শনের জন্য উচ্চ নির্ভুলতা UNICOMP X Ray CT মেশিন AX9500
High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT) Applications Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum
AX8200max ইলেকট্রনিক উপাদানগুলির অভ্যন্তরীণ ত্রুটি পরিদর্শনের জন্য ইউনিকম্প এক্স-রে সিস্টেম
90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Specification Of SMT X-Ray machine Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector
