bga x ray inspection system
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উচ্চ সংযোজন এক্স-রে মেশিন ইউনিকম্প AX7900 ব্যবহৃত মোবাইল ফোনের গুণমান পরিদর্শন জন্য
High magnifications X-ray machine Unicomp AX7900 for used mobile phone quality inspection Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location Accurate Control, CNC Programming Automatic
এসএমটি পিসিবি এক্স-রে মেশিন উচ্চ রেজোলিউশন মাইক্রন ফোকাস স্পট আকার ইউনিকম্প এএক্স 7900 সেলফোনের অভ্যন্তরের গুণমান এবং ফাটল পরিদর্শন করার জন্য
SMT PCB X-ray machine high resolution micron focus spot size Unicomp AX7900 for cellphone inside quality and cracks inspection Description of IC X Ray machine AX7900: It finds extensive application across multiple sectors such as BGA, CSP, Flip Chip technology, LEDs, Fuses, Diodes, PCBs, Semiconductors, the Battery Industry, small-scale metal casting, electronic connector modules, cables, aerospace components, and the Photovoltaic Industry, among others. FEATURES of IC Xray
সেলফোন পরিদর্শন এবং ফাটল পরীক্ষা করার জন্য ইউনিকম্প AX7900 উচ্চ স্পেসিফিকেশন 2D 2.5D এক্স-রে মেশিন
High specifications electronic boards 2D & 2.5D X-ray machine Unicomp AX7900 for used cellphone quality inspection and cracks checking Description of IC X Ray machine AX7900: It is widely used in various fields, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, small-scale metal casting, electronic connector modules, cables, aerospace components, as well as the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A
3.5kW LED বার ইনলাইন এক্স-রে মেশিন ADR সনাক্তকরণ সিস্টেম ভিতরের গুণমান পরিদর্শনের জন্য
LED bar Inline X-Ray ADR Detection System for Inside Quality Inspection Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell The Unicomp AX9100max X-ray Machine is designed for EV Cylindrical Cell inspection and is widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields diagram of Unicomp X-ray AX9100max Functions and Features Functions and features diagram of Unicomp X-ray AX9100max
90 কেভি মাইক্রন ফোকাস স্পট সাইজ টিউব এক্স-রে মেশিন ইউনিকম্প আপগ্রেড মডেল এএক্স 7900 মোবাইল ফোনের গুণমান পরীক্ষা করার জন্য দ্বৈত কম্পিউটার সহ
90KV micron focus spot size tube X-ray machine Unicomp upgraded model AX7900 with dual computers for checking the cellphone quality Description of IC X Ray machine AX7900: It has broad applications spanning BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small metal casting, electronic connector modules, cables, aerospace parts, and the photovoltaic industry, among other fields. FEATURES of IC Xray machine AX7900: Laser Pinpoint Inspection
ইউনিকম্প এএক্স৯১০০ম্যাক্স এক্স-রে মেশিন ২২০এসি ৫০হার্জ টিন ক্লাইম্বিংয়ের জন্য
Unicomp AX9100max X-ray Machine For Tin Climbing The Unicomp AX9100max X-ray Machine is specifically designed for tin climbing applications, offering advanced inspection capabilities for various industries. Application Fields Widely applied for: BGA, CSP, Flip Chip LED, Fuse, Diode PCB, Semiconductor Battery Industry Small Metal Casting Electronic Connector Module Cables Photovoltaic Industry Application fields of Unicomp X-ray AX9100max Functions and Features Functions and
ইলেকট্রনিক উপাদানগুলির অভ্যন্তরীণ ত্রুটি পরিদর্শনের জন্য Unicomp এক্স-রে সিস্টেম AX9100max
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
সিএনসি প্রোগ্রামযোগ্য স্বয়ংক্রিয় পরিদর্শন ইলেকট্রনিক্স এক্স-রে মেশিন AX9100MAX IC বাঁক পরিমাপের জন্য 60° কমন কোণ সহ
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
