bga inspection equipment
"
ইউনিকম্প CX3000 ডেস্কটপ ইলেকট্রনিক্স এক্স রে মেশিন রিল টু রিল JEDEC ট্রে এবং টিউব সহ
Electronics components couterfeit inspection with Unicomp desktop X-ray CX3000 with reel to reel, JEDEC tray and Tube Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection
শিল্পকৌশল এক্স রে ইমেজিং সিস্টেম 80kV / 90kV উত্স Submicron ফোকাল স্পট আয়তন সঙ্গে
Metal X Ray Machine 80kV / 90kV source with submicron focal spot size FEATURES: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x 420mm, max. detection area 380 x 380mm,
এসএমটি পিটিএইচ সোল্ডারিং ফিলিং রেট এবং বিজিএ ভ্যায়েড পরিদর্শনের জন্য উচ্চ পারফরম্যান্স এক্স-রে মেশিন AX9100
High Performace X-ray Machine AX9100 for SMT PTH soldering filling rate and BGA Void inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging
স্বয়ংক্রিয় পরিমাপের সাথে সেমিকন লিডফ্রেমের গুণমান পরীক্ষা করার জন্য 2.5D 110kv এক্স-রে মেশিন Unicomp AX8500
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
ডেস্কটপ বিজিএ ভিওডস 90 কেভি 8 ডব্লু ইলেকট্রনিক্স এক্স রে মেশিন 22 "এলসিডি
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22" LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.
ইলেকট্রনিক্স এক্স-রে ইন্সপেকশন মেশিন AX7900 ইউনিকম্প 5μm মাইক্রো ফোকাস অটো ভয়েড ডিটেকশন BGA সোল্ডার হাই প্রিসিশন
Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent
স্বয়ংচালিত সংযোগকারীর জন্য 130kV মাইক্রোফোকাস AX9100 ইউনিকম্প এক্স রে
130kV Microfocus X-ray AX9100 for automotive connector inner connection quality defect wire broken inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,
আইসি সেমিকন্ডাক্টর ইউনিকম্প এক্স রে হাই ম্যাগনিফিকেশন মাইক্রোফোকাস AX9100 130KV
Directly factory supply of microfocus X Ray System AX9100 with high magnification for IC Semiconductor Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification,
LED সিএসপি ফোন চেক করার জন্য CX3000 Benchtop এক্স রে মেশিন ছোট ইউনিট
CX3000 Benchtop Electronics X-ray Machine Small Unit for Checking LED CSP Phone FEATURES: 1. 5μm 100kV X-ray tube; 2. Dynamic FPD with high-resolution of 1000×1124; 3. Equipped with 360° rotary fixture to eliminate PoP shadow; 4. The detection area easily positioned by external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock and emergency button. OUR SERVICE 1. Your inquiry will be replied
