bga inspection equipment
"
তারের জোতা এবং তারের ফাটল পরিদর্শনের জন্য তির্যক দৃশ্য সহ Unicomp মাইক্রোফোকাস 2.5D এক্স-রে পরিদর্শন মেশিন AX7900
Unicomp microfocus 2.5D X-ray inspection machine AX7900 with oblique view for Wire harness & cables cracks inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines
সোলার সেল সোলারিংয়ের জন্য সিএসপি এএক্স 8200 ইলেক্ট্রনিক্স এক্স রে মেশিন 100 কেভি
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
80 কেভি/90 কেভি ইলেকট্রনিক্স এক্স রে মেশিন সঠিক অবস্থান চিপ অভ্যন্তরীণ ত্রুটি পরিদর্শন জন্য লেজার লোকেটার
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
অ্যালুমিনিয়াম মরা এসএমটি / ইএমএস এক্স রে মেশিন সিএনসি BGA ভয়েস জন্য প্রোগ্রামেবল সনাক্তকরণ
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 3µm closed X-ray tube, high speed &
মাইক্রো ফোকাস ইলেক্ট্রনিক্স এক্স রে সিস্টেম এসএমটি ইলেক্ট্রনিক্স অভ্যন্তরীণ ত্রুটি নিয়ন্ত্রণ
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
2.5 ডি শিরোনাম ইলেকট্রনিক্স এক্স রে মেশিন 40W ঘূর্ণন 360 ° 6 অক্ষ আন্দোলনের সাথে
Application SMT, BGA, CSP, Flip Chip, LED Detection, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Features Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with convenient target point positioning system 130kV (Option 110KV) 7µm closed X-ray tube,
মাল্টি ফাংশন ইলেক্ট্রনিক্স এক্স রে মেশিন গোল্ড বল জন্য উচ্চ গতির রিয়েল টাইম
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing
PCBA বোর্ড পরিদর্শনের জন্য HD ক্যামেরা Unicomp X Ray 130kV
Application SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
PCBA BGA CSP QFN রিফ্লো সোল্ডারিং মানের জন্য CNC প্রোগ্রামিং এক্স-রে সরঞ্জাম সহ Unicomp AX9100 স্বয়ংক্রিয় পরিমাপ
Unicomp AX9100 Automatic measurement with CNC programming X-Ray equipment for PCBA BGA CSP QFN reflow soldering quality Features of Unicomp AX9100: ● 90-130KV 7μm X-Ray tube.● High speed & Millions pixels high resolution FPD.● 1000X magnification, high-definition real-time image.● One-button operation with 2.5D image display.● Off-line programming function, navigation mode detection.● 7 axis linkage, 70 degree tilt detection.Applications of Unicomp AX9100: ● SMT, BGA, CSP,
