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160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp

মৌলিক বৈশিষ্ট্য
উৎপত্তি স্থান: চীন
ব্র্যান্ড নাম: Unicomp
সার্টিফিকেশন: CE, FDA
মডেল নম্বর: AX9600
বাণিজ্যিক সম্পত্তি
ন্যূনতম অর্ডার পরিমাণ: 1 সেট
দাম: can negotiate
পেমেন্ট শর্তাবলী: টি/টি, এল/সি
সরবরাহ ক্ষমতা: প্রতি মাসে 30 সেট
পণ্যের সারসংক্ষেপ
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp The UNICOMP AX9600 160KV microfocus X-ray inspection system is equipped with a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. Supporting a ...

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বিশেষভাবে তুলে ধরা:

160KV microfocus X-ray machine

,

semiconductor wire bonding inspection

,

NDT X-ray machine AX9600

Machine Type: সেমিকন্ডাক্টর মাইক্রোফোকাস এক্স-রে পরিদর্শন সরঞ্জাম
Dimensions: 1690mm(L)×2116mm(W)×1880mm(H)
Tube Type: ওপেন টাইপ
Machine Weight: 4590 কেজি
Voltage: 160KV
Model: AX9600
পণ্য বিবরণ
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
The UNICOMP AX9600 160KV microfocus X-ray inspection system is equipped with a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. Supporting a maximum geometric magnification of 2000× with superior X-ray penetrability, this system enables precise void fraction quantification for TVS diodes and serves as a high-accuracy inspection solution tailored for advanced IC packaging, HBM storage dies, and GPU semiconductor device quality verification.
Technical Specifications
System Summary
Dimensions 1690mm(L)×2116mm(W)×1880mm(H)
Weight 4590kg
Power Supply 220V±10% 50Hz/60Hz 9A
Power Consumption 2kw
X-ray Tube
Tube Type Open Type
Voltage 160kv
Max. Power 64W
Min.Resolution 1µm
Imaging System
X-ray Detector FPD
Pixel Size 84µm
Detection Area 129*129mm
Pixel Matrix 1536*1536[pixel]
Frame Rates Max 30fps
System Magnification 34000X
Motion Control System
Max. Payload Size 520*520[mm]
Max. Detection Size 520*520[mm]
X/Y/Z-Axis Travel Distance 550/710/265[mm]
Tilt and Rotation Detect XY±70° Tilt
Industrial PC
Motion Control Mode 34"HD 4K curved display
Operating System Windows 11 64-bit
Storage 4TB HDD+512G SSD
Memory 32G
Processor i5 12 generation
Other Features
Door Operation Automatic Door
X-Ray Safety <1µSv/h
Applications
The UNICOMP AX9600 high-power microfocus X-ray inspection system is engineered for ultra-precision non-destructive evaluation (NDE) of advanced semiconductors and microelectronic components. It delivers high-fidelity void fraction quantification for TVS diodes, alongside internal flaw inspection for advanced IC packages, HBM high-bandwidth memory dies, GPU modules and high-density electronic assemblies.
Extensively deployed for quality validation across automotive electronics, power semiconductors, aerospace-grade electronic hardware and miniature precision components, the system facilitates precise characterization of micro-voids, solder joint anomalies, internal fractures and assembly irregularities. It provides robust technical backing for R&D validation and mass production process quality control within the high-end semiconductor manufacturing sector.
Inspection Images
UNICOMP AX9600 X-ray inspection system sample inspection image showing high-precision component analysis
Sample Inspection Image
UNICOMP AX9600 X-ray inspection system dimensions and physical appearance diagram
System Dimensions and Appearance
সামগ্রিক মূল্যায়ন
5.0
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  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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