x ray inspection system
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পিসিবিএ 22 "এলসিডি 1kW এনডিটি ইলেক্ট্রনিক্স এক্স রে মেশিন
Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Features • Multi-function DXI image processing system, CNC programmable detection • Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification • 90kV 5µm closed X-ray tube, digital flat panel with 2 mega pixels CCD camera • Multi-function workstation with
এসএমটি 1 কেডব্লিউ 90 কেভি বিজিএ ভায়োডস এক্স রে সনাক্তকরণের সরঞ্জাম
Features • Multi-function DXI image processing system, CNC programmable detection • Multi-function workstation with ±60° tilt and X-Y multi-axis movement • 90kV 5µm closed X-ray tube, digital flat panel with 2 mega pixels CCD camera • X-ray tube & detector automatic lifting and descending, with convenient target point positioning system • Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification X-ray Images Item Description Specifications X-Ray
বিজিএ ভিওডস ওয়্যারিং বন্ডগুলি 1 কেডব্লিউ 90 কেভি ডিজিটাল এক্স রে মেশিন
Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification 600X Detector FPD Active Area: 130mm*130mm Resolution 58 LP/cm Camera 2 Mega Pixel CCD Motion range (Up and Down) 290mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22” LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area
এক্স-রে সিস্টেম AX9100max ইমেজ সুপার-রেজোলিউশন পুনর্গঠনের জন্য অ্যালগরিদম সহ
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
ইলেকট্রনিক বোর্ড 2D & 2.5D এক্স-রে মেশিন AX9100MAX 360 ডিগ্রী ঘূর্ণন টেবিল সঙ্গে BGA&PCB জন্য
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
UNX6030N এক্স-রে সিস্টেম ফর হ্যাম সসেজ / জর্কি / বাদাম বিদেশী বিষয় পরিদর্শন
Food Impurity Real Time Inline Detection UNX4015N For Food-Packing Quality Inspection Application UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Easy to Operate: one button start&stop, optional default product Sensitivity adjustment, alarm management,
ইউনিকম্প ইউএনসি২২৫ এক্স-রে মেশিন ২২৫ কিলোভোল্ট এ ০.৪ মিমি/১.০ মিমি ফোকাল আকারের পাওয়ার রেসিনে ত্রুটি সনাক্ত করে
Unicomp UNC225 X-Ray Identifies Flaws in Power resin Mainly used in metal castings, hardware products, plastic products, refractory materials, resin materials, composite materials, ceramic body and welding metal parts and other small products for non-destructive testing. Functional Characteristics 1. Wide range of applications to meet the inspection of multiple sizes and types of products. Low failure rate, best-selling equipment for 9 years 2. Safety: High level protection,
ইউনিকম্প ইউএনসি২২৫ এক্স-রে পাওয়ার রেসিনে অভ্যন্তরীণ ত্রুটি সনাক্ত করার চূড়ান্ত সমাধান
Detect Internal Defects in Power resin with Unicomp UNC225 X-Ray Primarily utilized for non-destructive testing of small items such as metal castings, hardware products, plastics, refractory materials, resin materials, composites, ceramic bodies, and welded metal components, among others. Functional Characteristics It boasts a wide array of applications, accommodating the inspection needs of various sizes and types of products. With a low failure rate, it has been a top
আইসি কার্ভারেজ পরিমাপ Unicomp AX9100MAX এক্স-রে মেশিন 84μm পিক্সেল আকার এবং 60° কুলিং কোণ সঙ্গে
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
