x ray imaging system
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সিএনসি প্রোগ্রামেবল কন্ট্রোল এক্স রে মেশিন 8 কেডব্লিউ ইউনিকম্প ইউএনসি 225
Cast Parts Industrial X Ray Machine Real Time Imaging Inspection UNC225 UNC225 is a robust, reliable industrial X-ray inspection system for broad applications in foundries, R&D, laboratories, universities, and educational institutions. The system delivers brilliant image quality with digital flat-panel detector and highly dynamic radioscopy. Smart ergonomics for easy operation Tailor-made configuration for wheels and tires Renowned, robust, reliable digital X-ray inspection
ইলেকট্রনিক উপাদানগুলির অভ্যন্তরীণ ত্রুটি পরিদর্শনের জন্য Unicomp এক্স-রে সিস্টেম AX9100max
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
ইলেকট্রনিক্স আইসি উপাদানগুলির জন্য উচ্চ প্রসারিত PCB এক্স-রে মেশিন Unicomp AX9100MAX
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
সিএনসি প্রোগ্রামযোগ্য স্বয়ংক্রিয় পরিদর্শন ইলেকট্রনিক্স এক্স-রে মেশিন AX9100MAX IC বাঁক পরিমাপের জন্য 60° কমন কোণ সহ
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
এসএমটি পিসিবি এক্স-রে মেশিন মাইক্রন ফোকাস স্পট আকার BGA শূন্যতা পরিমাপ এবং solder গত আরোহণ উচ্চতা পরিদর্শন জন্য
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
১৩০ কেভি মাইক্রন ফোকাস স্পট সাইজ টিউব এক্স-রে মেশিন AX9100MAX PCB&BGA পরিদর্শনের জন্য দ্বৈত কম্পিউটার সহ
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
ইলেকট্রনিক বোর্ড 2D & 2.5D এক্স-রে মেশিন AX9100MAX 360 ডিগ্রী ঘূর্ণন টেবিল সঙ্গে BGA&PCB জন্য
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
ব্রেক প্যাডের অভ্যন্তরীণ ত্রুটি সনাক্ত করার জন্য Unicomp UNC160 NDT এক্স রে সরঞ্জাম
Unicomp UNC160 X-Ray for detecting internal defects in brake pads Product Description: Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features: Widespread Applications: Large inspection size and loading weight capacity Safety Standard: High level protection with international standard, multiple safety set up Image Proccessing:
ইউনিকম্প ইউএনসি১৬০ এক্স-রে সরঞ্জাম দিয়ে ব্রেক প্যাডের অভ্যন্তরীণ ত্রুটি সনাক্ত করুন
Detect Internal Flaws in Brake Pads with Unicomp UNC160 X-Ray Product Description: Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features: niversal Applications: Capable of inspecting large sizes and heavy loads. Safety Compliance: Meets international standards with robust safety measures. Image Processing: High-quality, swift
