x ray imaging system
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স্পিন শিলা শ্রীমতি / ইএমএস এক্স রে গিয়ারবক্স বিভাগ জন্য মেশিন Unicomp প্রযুক্তি
Gearbox Section Sponge Shrinkage Metal X Ray Detection Machine in Malaysia Unicomp Technology UNC series offer dynamic lines of imaging systems and services for automotive components that detect defects. Safety-critical cast component manufacturers utilize x-ray inspection technology to verify casting integrity. Casting defects such as cavities, gas, inclusion, tearing, foreign material, porosity, shrinkage and sponge are found quickly and objectively using x-ray inspection.
PCBA BGA CSP QFN রিফ্লো সোল্ডারিং মানের জন্য CNC প্রোগ্রামিং এক্স-রে সরঞ্জাম সহ Unicomp AX9100 স্বয়ংক্রিয় পরিমাপ
Unicomp AX9100 Automatic measurement with CNC programming X-Ray equipment for PCBA BGA CSP QFN reflow soldering quality Features of Unicomp AX9100: ● 90-130KV 7μm X-Ray tube.● High speed & Millions pixels high resolution FPD.● 1000X magnification, high-definition real-time image.● One-button operation with 2.5D image display.● Off-line programming function, navigation mode detection.● 7 axis linkage, 70 degree tilt detection.Applications of Unicomp AX9100: ● SMT, BGA, CSP,
সিই কম্পিউটার মাদারবোর্ড চিপসেট এক্স রে পরিদর্শন মেশিন AX9100
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
এসএমটি বিজিএ সোল্ডারিং অকার্যকর পরিমাপ এক্স-রে মেশিন মাইক্রোফোকাস 130 কেভি
130kV 7 μm Microfovus X-Ray Machine For SMT BGA Soldering Void Measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One
সিএনসি প্রোগ্রামিং এক্স রে ডিটেক্টর পিসিবিএ বিজিএ সিএসপি কিউএফএন জন্য স্বয়ংক্রিয়
Automatic Measurement With CNC Programming X-Ray Equipment For PCBA BGA CSP QFN Reflow Soldering Quality Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Test Images: Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 5μm X-Ray tube. ●
এসএমটি বিজিএ সোল্ডারিংয়ের জন্য মাইক্রোফোকাস ক্লোজড টিউব ইউনিকম্প এক্স এক্স 130 কেভি 3 ম
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnificati
রিয়েল টাইম ইউনিকম্প এক্স এক্স 1.6 কেডব্লিউ এএক্স 9100 ইলেক্ট্রনিকস অ্যাসেমব্লির জন্য
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power
বিজিএ কিউএফএন ইউনিকম্প এক্স এক্স পরিদর্শন সিস্টেম 130 কেভি 6 অ্যাক্সিস মুভমেন্ট সহ
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
সিএসপি ইএমএস বিজিএর জন্য 3µM মাইক্রোফোকাস টিউব এক্স রে মেশিন AX9100
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
