real time x ray system
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LED স্ট্রিপ অনলাইন ADR এক্স-রে পরিদর্শন সরঞ্জাম FPD 6 অক্ষ সংযোগ ব্যবস্থা
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● Modular design with In-line expansibility. ● Economical and Practical. ● Real-time image. ● 1000X system magnification. ● 100KV 5μm X-Ray tube. ● FPD Detector. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta
100KV ইনলাইন এক্স রে ADR ডিটেকশন সিস্টেম বিজিএ ইএমএস ভিতরের গুণমান পরিদর্শনের জন্য
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● Real-time image. ● 1000X system magnification. ● 100KV 5μm X-Ray tube. ● Modular design with In-line expansibility. ● Economical and Practical. ● FPD Detector. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta
ইলেকট্রনিক্স শিল্পের জন্য গুণমান / অকার্যকর ত্রুটি সনাক্তকরণ ইউনিকম্প এক্স এক্স রে স্ট্রিপ সোল্ডারিং
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● Modular design with In-line expansibility. ● Economical and Practical. ● 100KV 5μm X-Ray tube. ● FPD Detector. ● Real-time image. ● 1000X system magnification. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. Applications: ● Aluminum Die Casting, Moulding Plastic. ● Ceramics, Other Special Industries. ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor
সিই কম্পিউটার মাদারবোর্ড চিপসেট এক্স রে পরিদর্শন মেশিন AX9100
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
আইসি হাই ইমেজ রেজোলিউশন ইউনিকম্প ওয়েল্ড এক্স রে পরিদর্শন মেশিন মাইক্রোফোকাস
Unicomp--China Lead X-Ray Manufacturer'S Microfocus X-Ray With High Image Resolution For IC PCBA Soldering Inspection Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
এসএমটি বিজিএ সোল্ডারিং অকার্যকর পরিমাপ এক্স-রে মেশিন মাইক্রোফোকাস 130 কেভি
130kV 7 μm Microfovus X-Ray Machine For SMT BGA Soldering Void Measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One
সিএনসি প্রোগ্রামিং এক্স রে ডিটেক্টর পিসিবিএ বিজিএ সিএসপি কিউএফএন জন্য স্বয়ংক্রিয়
Automatic Measurement With CNC Programming X-Ray Equipment For PCBA BGA CSP QFN Reflow Soldering Quality Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Test Images: Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 5μm X-Ray tube. ●
এসএমটি বিজিএ সোল্ডারিংয়ের জন্য মাইক্রোফোকাস ক্লোজড টিউব ইউনিকম্প এক্স এক্স 130 কেভি 3 ম
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnificati
ইউনিকম্প মাইক্রোফোকস এক্স রে পরিদর্শন সিস্টেম 130 কেভি 3 এম এফপিডি চিত্রের জন্য
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power
