pcb x ray inspection
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ইলেকট্রনিক্সের জন্য মাইক্রোফোকাস 2.5D ইউনিকম্প এক্স রে AX8200 সর্বোচ্চ 5um 6 অক্ষ ম্যানিপুলেটর
Unicomp AX8200Max 5um microfocus 2.5D X Ray Machine with 6 Axis Manipulator For Automotive electronics quality checking Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3.
স্বয়ংচালিত ইলেকট্রনিক্সের জন্য টিউব Unicomp X Ray AX8200 Max 5μM বন্ধ করুন
Using Unicomp AX8200Max close tube Microfocus X-ray to detect Automotive electronics inner quality defects Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control,
PCBA BGA QFN এর জন্য Unicomp AX8200MAX 2.5D এক্স রে মেশিন অটো মেজারমেন্ট
Unicomp AX8200MAX 2.5D X-ray machine for PCBA BGA QFN soldering voids Auto measurement Application Fields of AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of AX8200max 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate
রিয়েল টাইম ইউনিকম্প এক্স রে মেশিন AX8200MAX 5 মাইক্রোন ক্লোজড টিউব এসএমটি ইএমএস বিজিএ ভয়েড চেকের জন্য
Real-time X-Ray machine Unicomp AX8200MAX with 5 micron closed tube for SMT EMS BGA void check Application Fields of BGA Xray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of BGA Xray machine 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD
90 কেভি মাইক্রন ফোকাস স্পট সাইজ টিউব এক্স-রে মেশিন ইউনিকম্প আপগ্রেড মডেল এএক্স 7900 মোবাইল ফোনের গুণমান পরীক্ষা করার জন্য দ্বৈত কম্পিউটার সহ
90KV micron focus spot size tube X-ray machine Unicomp upgraded model AX7900 with dual computers for checking the cellphone quality Description of IC X Ray machine AX7900: It has broad applications spanning BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small metal casting, electronic connector modules, cables, aerospace parts, and the photovoltaic industry, among other fields. FEATURES of IC Xray machine AX7900: Laser Pinpoint Inspection
ইউনিকম্প এএক্স৯১০০ম্যাক্স এক্স-রে মেশিন ২২০এসি ৫০হার্জ টিন ক্লাইম্বিংয়ের জন্য
Unicomp AX9100max X-ray Machine For Tin Climbing The Unicomp AX9100max X-ray Machine is specifically designed for tin climbing applications, offering advanced inspection capabilities for various industries. Application Fields Widely applied for: BGA, CSP, Flip Chip LED, Fuse, Diode PCB, Semiconductor Battery Industry Small Metal Casting Electronic Connector Module Cables Photovoltaic Industry Application fields of Unicomp X-ray AX9100max Functions and Features Functions and
ইউনিকম্প AX9100max এক্স-রে মেশিন 130kV 65W BGA এর জন্য
Unicomp AX9100max X-ray Machine 130kV 65W FOR BGA The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields of Unicomp AX9100max X-ray Machine Functions and Features Functions and features of Unicomp AX9100max X-ray
ইলেকট্রনিক উপাদানগুলির অভ্যন্তরীণ ত্রুটি পরিদর্শনের জন্য Unicomp এক্স-রে সিস্টেম AX9100max
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
সিএনসি প্রোগ্রামযোগ্য স্বয়ংক্রিয় পরিদর্শন ইলেকট্রনিক্স এক্স-রে মেশিন AX9100MAX IC বাঁক পরিমাপের জন্য 60° কমন কোণ সহ
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
