pcb inspection system
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এসএমটি বিজিএ সোল্ডারিংয়ের জন্য 0.8 কেডাব্লু 5 ম এফডিএ ইলেকট্রনিক্স এক্স রে মেশিন
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. System
মোবাইল ফোন পিসিবিএর জন্য 0.8 কেডব্লিউ বিজিএ অকার্যকর পরিমাপ এক্স রে মেশিন
X-Ray Inspection Machine Electronics BGA Standard Multifunction Technical Data System SummaryFootprint1080(W)×1180(D)×1730(H)mmMachine Weight1050 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size146(W)×128(D)×196(H)cmPacking Weight1160 kgPower Consumption1.0 kWX-Ray TubeTube TypeSealedMax. Power8WVoltage0~90kV (Adjustable)Focus Spot Size5μmImaging SystemDetectorFlat Panel Detector (option 4’’ i.i. Detector)Pixel Size85μmEffective Detection Area130*130mmFrame Rates20fpsPi
এএক্স৯১০০ম্যাক্স ফিক্সড পয়েন্ট ফলোিং সহ ইলেকট্রনিক্স এক্স রে মেশিন
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
এক্স-রে সিস্টেম AX9100max ইমেজ সুপার-রেজোলিউশন পুনর্গঠনের জন্য অ্যালগরিদম সহ
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
আইসি কার্ভারেজ পরিমাপ Unicomp AX9100MAX এক্স-রে মেশিন 84μm পিক্সেল আকার এবং 60° কুলিং কোণ সঙ্গে
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
90 কেভি মাইক্রন ফোকাস স্পট সাইজ টিউব এক্স-রে মেশিন ইউনিকম্প আপগ্রেড মডেল এএক্স 7900 মোবাইল ফোনের গুণমান পরীক্ষা করার জন্য দ্বৈত কম্পিউটার সহ
90KV micron focus spot size tube X-ray machine Unicomp upgraded model AX7900 with dual computers for checking the cellphone quality Description of IC X Ray machine AX7900: It has broad applications spanning BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small metal casting, electronic connector modules, cables, aerospace parts, and the photovoltaic industry, among other fields. FEATURES of IC Xray machine AX7900: Laser Pinpoint Inspection
90kv এক্স রে মেশিন উচ্চ রেজোলিউশন Unicomp AX7900 সঙ্গে 5um টিউব জন্য BGA বন্ডিং তারের বাঁক পরীক্ষা
90kv X ray machine high resolution Unicomp AX7900 with 5um tube for BGA bonding wires curvature testing Description of IC X Ray machine AX7900: It is broadly utilized in industries such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location
ইউনিকম্প এএক্স৯১০০ম্যাক্স এক্স-রে মেশিন ২২০এসি ৫০হার্জ টিন ক্লাইম্বিংয়ের জন্য
Unicomp AX9100max X-ray Machine For Tin Climbing The Unicomp AX9100max X-ray Machine is specifically designed for tin climbing applications, offering advanced inspection capabilities for various industries. Application Fields Widely applied for: BGA, CSP, Flip Chip LED, Fuse, Diode PCB, Semiconductor Battery Industry Small Metal Casting Electronic Connector Module Cables Photovoltaic Industry Application fields of Unicomp X-ray AX9100max Functions and Features Functions and
ইউনিকম্প AX9100max এক্স-রে মেশিন 130kV 65W BGA এর জন্য
Unicomp AX9100max X-ray Machine 130kV 65W FOR BGA The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields of Unicomp AX9100max X-ray Machine Functions and Features Functions and features of Unicomp AX9100max X-ray
