industrial inspection systems
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১৩০ কেভি 5μ এম এক্স রে পরিদর্শন সরঞ্জাম 1.2 মি এলইডি লাইটের জন্য
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification
<7μm মাইক্রো ফোকাস 41X ম্যাগনিফিকেশন IC সেমিকন্ডাক্টর কম্পোনেন্ট এক্সরে ইকুইপমেন্ট AX9100 Unicomp CNC স্বয়ংক্রিয় পরিদর্শন
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 130KV 7μm X-Ray Sealed tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
আইসি হাই ইমেজ রেজোলিউশন ইউনিকম্প ওয়েল্ড এক্স রে পরিদর্শন মেশিন মাইক্রোফোকাস
Unicomp--China Lead X-Ray Manufacturer'S Microfocus X-Ray With High Image Resolution For IC PCBA Soldering Inspection Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
পিসিবিএ পরিদর্শনের জন্য ফাইনফোকাস টিউব 100 কেভি এক্স রে স্ক্যানার এএক্স 8200
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. Technical Data
320 কেভি এক্স রে পরিদর্শন সরঞ্জাম সিএনসি যানবাহন যন্ত্রাংশ জন্য নিয়ন্ত্রণ
Dynamic Precise Casting Part Inspection Real Time X-ray Image System The UNC320 is the newest standard system. Whether you are inspecting small or large components, the UNC320 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system. System Parameters Dimensions 2100mm*1720mm*2470mm(L*W*H) Equipment weight 3.5T Power 6kW Maximum penetration (AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight
লো ব্রেকডাউন যানবাহন যন্ত্রাংশ এক্স রে পরিদর্শন মেশিন 320 কেভি ইউনিকম্প
Dynamic Precise Casting Part Inspection Real Time X-ray Image System The UNC320 is the newest standard system. Whether you are inspecting small or large components, the UNC320 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system. SYSTEM CAPABILITIES Advanced 2D X-ray inspection Overall Maximum System Resolution: ~5 microns 50cm diameter x 80cm tall nominal part envelope Comprehensive acquisition,
Unicomp UNC320 শিল্প এক্স-রে সরঞ্জাম 360° ঘূর্ণমান পরিদর্শন পোরোসিটি গণনা স্বয়ংচালিত কাস্টিং এক্স-রে এনডিটি
Unicomp UNC320 Industrial X-ray Equipment 360° Rotary Inspection Porosity Calculation Automotive Casting X-ray NDT The UNC320 is the newest standard system. Whether you are inspecting small or large components, the UNC320 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system. SYSTEM CAPABILITIES Advanced 2D X-ray inspection Overall Maximum System Resolution: ~5 microns 50cm diameter x 80cm tall
ইউনিকম্প মাইক্রোফোকস এক্স রে পরিদর্শন সিস্টেম 130 কেভি 3 এম এফপিডি চিত্রের জন্য
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power
বিজিএ কিউএফএন ইউনিকম্প এক্স এক্স পরিদর্শন সিস্টেম 130 কেভি 6 অ্যাক্সিস মুভমেন্ট সহ
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
