electronic inspection equipment
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বেঞ্চ শীর্ষ eldালাই ভয়েডগুলি 0.5 কেডব্লিউ 90 কেভি এক্স রে পরিদর্শন মেশিন 5µm
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic, Ceramics, other special industries. Features 90kV 5µm closed X-ray tube High resolution FPD with 3-axis motion system, meet basic inspection demands Navigation in windows, target tracking conveniently Max. loading area 235mm×205mm mm, max. inspection area 165mm×190mm, with
পোর্টেবল 1uSv / h 90kV 0.5kW এক্স রে পরিদর্শন মেশিন পিসিবিএর জন্য
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22” LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.
এসএমটি বিজিএ সোল্ডারিংয়ের জন্য 0.8 কেডাব্লু 5 ম এফডিএ ইলেকট্রনিক্স এক্স রে মেশিন
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. System
পিসিবিএ পরিদর্শনের জন্য ফাইনফোকাস টিউব 100 কেভি এক্স রে স্ক্যানার এএক্স 8200
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. Technical Data
বিজিএ কিউএফএন ইউনিকম্প এক্স এক্স পরিদর্শন সিস্টেম 130 কেভি 6 অ্যাক্সিস মুভমেন্ট সহ
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
ইলেকট্রনিক্স উপাদানগুলির জন্য টিউব ইউনিকম্প এক্স রে AX9100 130kV বন্ধ করুন
130kV close tube X-ray Equipment AX9100 with high resolution FPD for electronics components couterfeit inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification,
ইলেকট্রনিক্স উপাদান পরিদর্শনের জন্য ডেস্কটপ অফলাইন BGA X Ray মেশিন 5um
Desktop Offline BGA X-Ray Machine 5um For Electronics Components Inspection OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to support you.
ক্যাপাসিটরের অভ্যন্তরীণ ত্রুটি পরিদর্শনের জন্য রিয়েল টাইম ডিজিটাল এক্স-রে মেশিন AX7900
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
LX2000 ওয়ার্কশপ ইলেকট্রনিক্স এক্স-রে মেশিন পরিদর্শন সিস্টেম 2KW বিদ্যুত ব্যবহার
LX2000 Workshop Electronics X-ray Machine Inspection System Battery Unicomp Technology upholds its Integrity, Deploitation and Excellence in the business, is committed to meeting the highest level of International Standards and promises to be a responsive partner with all of our customers. This philosophy has enabled Unicomp to generated a strong Global customer base of many International Renowned companies including Flextronics, Foxconn, Samsung, GM, Bosch, Emerson, Delphi
