bga x ray machine
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পিসিবি / বিজিএ কানেক্টিভিটি এবং বিশ্লেষণের জন্য ইলেকট্রনিকস বেঞ্চটাস এক্স রে মেশিন
BGA connectivity and analysis Benchtop X Ray Machine for PCB Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray Leakage
AX9100 Unicomp 2.5D Pcb X Ray Machine 130KV LED শূন্য পরিদর্শনের জন্য বন্ধ টিউব
AX9100 Unicomp 2.5D Pcb X Ray Machine 130KV Closed Tube For LED Void Inspection Unicomp AX9100 130KV Closed Tube 2.5D X-ray for LED PCBA soldering void quality inspection Pcb X Ray Machine Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt
CE FDA এর সাথে IC সেমিকন লিড ফ্রেম পরিদর্শনের জন্য 2D মাইক্রোফোকাস এক্স রে মেশিন
2D microfocus X Ray machine for IC semicon Lead frame inspection with CE FDA compliance FEATURES of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm
ক্যাপাসিটরের অভ্যন্তরীণ ত্রুটি পরিদর্শনের জন্য রিয়েল টাইম ডিজিটাল এক্স-রে মেশিন AX7900
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
80 কেভি/90 কেভি ইলেকট্রনিক্স এক্স রে মেশিন সঠিক অবস্থান চিপ অভ্যন্তরীণ ত্রুটি পরিদর্শন জন্য লেজার লোকেটার
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
ইলেকট্রনিক্স এক্স রে মেশিন সঠিক নিয়ন্ত্রণ চিপসেট ত্রুটি সনাক্তকরণের জন্য সিএনসি প্রোগ্রামিং
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
ইলেকট্রনিক্স শ্রীমতি বিজিএ এক্স-রে পরিদর্শন সিস্টেম 130 কেভি সিএসপি এলএক্স 9100, 1900 কেজি
Electronics SMT BGA X-ray Detection Equipment 130KV CSP LED AX9100 Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● 7 axis linkage, 70 degree tilt detection. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ●
অ্যালুমিনিয়াম মরা এসএমটি / ইএমএস এক্স রে মেশিন সিএনসি BGA ভয়েস জন্য প্রোগ্রামেবল সনাক্তকরণ
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 3µm closed X-ray tube, high speed &
উচ্চ রেজোলিউশন ফ্লিপ চিপ ইউনিকম্প কম্পিউটার ইলেক্ট্রনিক্স এক্স রে মেশিন এএক্স 8200
Electronics X-Ray Unicomp AX8200 Machine With Direct Factory PriceThe AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework operation.
